自動化服務 | DUO-KANG

AUTOMATION

DUO-KANG has an expertise team of automation and will be your solid consulter in the beginning phase for providing reliable solutions, designing and building up model/sample in accordance with GAMP-5 or SEMI S2/S26 standards.

Enjoy our customized service

We’re serving on automatic equipment of PC-Base, PLC-Base & Embedded System. Such as combining machine vision, motion control, I/O, robots, process control etc. In very skillful and capable to design, develop specified equipment for fulfilling your requirement.

Services:

Automatic System Analysis.
Automatic System Integration.
Automatic / Semi-automatic Equipments Design & Build Up.
Based on PC, PLC or Embedded System Control.
Software Programming.
Coding / Decoding Process
I/O Interface / Machine Vision / Motion Control Desgin.
Fixture Design & Build Up.
DQ / IQ / OQ / PQ Process.
LabVIEW Programming.

SECS / GEM & GEM300 Semiconductor Equipments Communication Standard.

DUO-KANG provides customized SECS / GEM & GEM300 (Semiconductor Equipment Communication Standard) development services to assist customers in supplying equipment to semiconductor manufacturers who are required to carry SECS / GEM or GEM300, reducing equipment development costs and time.

We use SECS / GEM & GEM300 Driver, which is self-developed based on NI LabVIEW language, so we can do everything from the software communication layer to the user interface layer, and we have and provide customers with the most complete solution.

Smart Factory & Industry 4.0

We assist customers in customizing the development of PC or PLC-Base automation equipment that meets SECS / GEM or GEM300. Our professional engineers can assist our customers and end users to discuss and formulate requirements and specifications during the initial development of the equipment. Our services include:

Assist in the formulation of SECS/GEM application functional specifications.
Assist in writing machine SECS/GEM User Manual.
Develop SECS/GEM application and equipment data exchange interface.
Perform EQP & EAP integration testing with equipment.

300 mm (12") WAFER BONDEING SYSTEM (DWB-300B)

The DWB-300B Wafer Bonding System is a highly flexible R&D system, bonding the wafer to the carrier with adhesive at the specific high temperature and bonding pressure for all wafer bonding processes such as anodic, e.g. compression, fusion bonding... plasma bonding. that can handle substrate pieces up to 300mm (12") wafers.
The equipment supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than 10 minutes, making it ideal for small-volume production as well as universities and R&D applications.

Features:

Programmable by bond force controller.
Have pressure meter with show bonding of pressure.
Bonding pressure : 1000N - 20000N (Max)
Bonding pressure force control accuracy: <+/- 3%
Bonding temperature : 500°C (Max)
Bonding temperature accuracy: <+/- 2%
Bonding uniformity test : <+/- 3%
Down to 5.0 X 10¯5mbar with turbo molecular pump for High-vacuum capable bond chamber.
Open chamber design for fast conversion and maintenance.
Operation interface by Windows based control software.

200 mm (8") WAFER BONDING SYSTEM (DWB-200A)

The DWB-200A Wafer Bonding System is a highly flexible R&D system, bonding the wafer to the carrier with adhesive at the specific high temperature and bonding pressure for all wafer bonding processes such as anodic, e.g. compression, fusion bonding... plasma bonding. that can handle substrate pieces up to 200mm (8") wafers.
The equipment supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than 20 minutes, making it ideal for small-volume production as well as universities and R&D applications.